Manufacturing Process
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Samsung to Reportedly Start Manufacturing Its Next-Gen AI Memory Chip in 2026
Samsung and SK Hynix are reportedly set to begin mass production of sixth-generation high-bandwidth memory chips (HBM4) in 2026. The AI-optimised memory is expected to first roll out from Samsung in February, followed by SK Hynix around September, with much of the output earmarked for Nvidia’s Vera Rubin AI accelerators. Neither company’s HBM4 ...
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Samsung Could Reportedly Strike a Deal With AMD to Build Future 2nm Process Chipsets
Samsung is reportedly in talks with AMD to manufacture future CPUs using its 2nm foundry process. The partnership could be finalised by January 2026, with Samsung first producing a prototype chip to meet AMD’s performance targets. The report suggests AMD is exploring Samsung as an alternative to TSMC, which has recently raised manufacturing costs...
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Elon Musk Reveals Tesla Is Starting AI5 Chip Tape Out, to Scale AI Chipset Development
Tesla has begun the tape out process for its new AI5 chipset, the successor to the AI4 chip used in current Tesla vehicles. Elon Musk also confirmed that work on the next generation AI6 chip is underway as the company plans to scale its in-house silicon efforts. Tesla aims to move to yearly chip design cycles and eventually manufacture more AI chip...
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TSMC Reportedly Informs Apple of Higher Chip Fabrication Costs Under 5nm Next Year
Manufacturing the iPhone and other devices could become more expensive for Apple due to the alleged rise in costs. As per a tipster, the Cupertino-based tech giant has been informed by TSMC of the impending rise in advanced fabrication processes of chipsets under 5 (nm) next year. While the general increase in production costs is said to be between...
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MediaTek Dimensity 8500 SoC Architecture, Specifications Leaked; Could Launch Soon
MediaTek Dimensity 8500 chip, expected to succeed the Dimensity 8400 SoC, could be manufactured using Taiwan Semiconductor Manufacturing Company's (TSMC) 4nm process, a tipster revealed. This comes a month after the tech firm launched its flagship Dimensity 9500 chip. Earlier reports suggest that the Dimensity 8500 SoC will be featured on the Xiaom...
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Coconut Water Processing Video Concerns Foodies With Heavy Plastic Usage
The coconut water manufacturing process begins with the selection of tender coconuts.
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Intel Said to Be Struggling With Key Manufacturing Process for Next PC Chip
Early tests disappointed customers last year, but Intel has said its 18A is on track to make its "Panther Lake" laptop semiconductors at high volume starting in 2025, which include next-generation transistors and a more efficient way to deliver power to the chip.
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Adani Ports Unveils Steel Slag Road in Hazira, World's 1st In A Private Port
In a landmark step for green infrastructure, Adani Ports and Special Economic Zone Ltd (APSEZ) has inaugurated the world's first steel slag road at any port, setting a new global benchmark in circular economy-led development.
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Plastic To Paracetamol: Scientists Convert Waste Into Painkiller In 24 Hours
Scientists at the University of Edinburgh have developed a process using E. coli bacteria to convert PET plastic waste into paracetamol, offering a sustainable alternative to traditional drug manufacturing methods that rely on fossil fuels.
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Samsung’s Exynos 2500 SoC Confirmed to Feature Satellite Connectivity Ahead of Galaxy Z Flip 7 Launch
Samsung’s Exynos 2500 system-on-a-chip (SoC) is now confirmed to feature satellite connectivity for emergency messaging. The confirmation came from Skylo, a US-based non-terrestrial network (NTN) provider, on Monday. This is the second confirmed information about the South Korean tech giant’s next-generation 3nm processor, whose development was...
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iPhone 18 Pro, iPhone 18 Pro Max and iPhone 18 Fold Said to Debut With 2nm A20 Chipset in 2026
After using TSMC’s 3nm process for its iPhone 15 Pro and iPhone 16 Pro series, Apple seems to be in a position to switch to an even more efficient 2nm manufacturing process, for its future iPhone 18 Pro models. The 2nm node is expected to bring better power efficiency among other benefits.
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Samsung Galaxy Z Flip 7 to Arrive With Samsung’s First 3nm Chip After Skipping the Galaxy S25 Series: Report
Samsung’s Galaxy Z lineup this year is going to be an interesting one for several reasons. The book-style foldable, the Samsung Galaxy Z Fold 7 is set to get a bigger display, while the upcoming Galaxy Z Flip clamshell style foldable is said to get minor updates, there’s also a new FE model which showed up in the rumour mill recently. New infor...
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HP Eyes Software Differentiation as AI PCs Blur the Lines Between Device and Experience
PC brands have found themselves in a unique position ever since the rise of the AI PCs. The terminology refers to a new class of computers that are equipped with dedicated neural processing units (NPUs) to power artificial intelligence (AI) capabilities and workflows. The chipsets are currently being manufactured by AMD, Intel, and Qualcomm’s Sna...
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Intel CEO Lip-Bu Tan Says Company Will Spin Off Non-Core Units
Intel will spin off assets that aren’t central to its mission and create new products. The company needs to replace the engineering talent it has lost, improve its balance sheet and better attune manufacturing processes to meet the needs of potential customers, Tan said.
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Apple Said to Ramp Up Hiring Ahead of Plans to Begin iPad, MacBook and AirPods Manufacturing in India
Apple is reportedly expanding its workforce across various divisions in India. Since 2017, the Cupertino-based company has been manufacturing iPhone models in the country and is now aiming to reduce its reliance on China by diversifying its manufacturing processes and enhancing supply chain resilience. As part of this strategy, Apple is said to be ...
-
Samsung to Reportedly Start Manufacturing Its Next-Gen AI Memory Chip in 2026
Samsung and SK Hynix are reportedly set to begin mass production of sixth-generation high-bandwidth memory chips (HBM4) in 2026. The AI-optimised memory is expected to first roll out from Samsung in February, followed by SK Hynix around September, with much of the output earmarked for Nvidia’s Vera Rubin AI accelerators. Neither company’s HBM4 ...
-
Samsung Could Reportedly Strike a Deal With AMD to Build Future 2nm Process Chipsets
Samsung is reportedly in talks with AMD to manufacture future CPUs using its 2nm foundry process. The partnership could be finalised by January 2026, with Samsung first producing a prototype chip to meet AMD’s performance targets. The report suggests AMD is exploring Samsung as an alternative to TSMC, which has recently raised manufacturing costs...
-
Elon Musk Reveals Tesla Is Starting AI5 Chip Tape Out, to Scale AI Chipset Development
Tesla has begun the tape out process for its new AI5 chipset, the successor to the AI4 chip used in current Tesla vehicles. Elon Musk also confirmed that work on the next generation AI6 chip is underway as the company plans to scale its in-house silicon efforts. Tesla aims to move to yearly chip design cycles and eventually manufacture more AI chip...
-
TSMC Reportedly Informs Apple of Higher Chip Fabrication Costs Under 5nm Next Year
Manufacturing the iPhone and other devices could become more expensive for Apple due to the alleged rise in costs. As per a tipster, the Cupertino-based tech giant has been informed by TSMC of the impending rise in advanced fabrication processes of chipsets under 5 (nm) next year. While the general increase in production costs is said to be between...
-
MediaTek Dimensity 8500 SoC Architecture, Specifications Leaked; Could Launch Soon
MediaTek Dimensity 8500 chip, expected to succeed the Dimensity 8400 SoC, could be manufactured using Taiwan Semiconductor Manufacturing Company's (TSMC) 4nm process, a tipster revealed. This comes a month after the tech firm launched its flagship Dimensity 9500 chip. Earlier reports suggest that the Dimensity 8500 SoC will be featured on the Xiaom...
-
Coconut Water Processing Video Concerns Foodies With Heavy Plastic Usage
The coconut water manufacturing process begins with the selection of tender coconuts.
-
Intel Said to Be Struggling With Key Manufacturing Process for Next PC Chip
Early tests disappointed customers last year, but Intel has said its 18A is on track to make its "Panther Lake" laptop semiconductors at high volume starting in 2025, which include next-generation transistors and a more efficient way to deliver power to the chip.
-
Adani Ports Unveils Steel Slag Road in Hazira, World's 1st In A Private Port
In a landmark step for green infrastructure, Adani Ports and Special Economic Zone Ltd (APSEZ) has inaugurated the world's first steel slag road at any port, setting a new global benchmark in circular economy-led development.
-
Plastic To Paracetamol: Scientists Convert Waste Into Painkiller In 24 Hours
Scientists at the University of Edinburgh have developed a process using E. coli bacteria to convert PET plastic waste into paracetamol, offering a sustainable alternative to traditional drug manufacturing methods that rely on fossil fuels.
-
Samsung’s Exynos 2500 SoC Confirmed to Feature Satellite Connectivity Ahead of Galaxy Z Flip 7 Launch
Samsung’s Exynos 2500 system-on-a-chip (SoC) is now confirmed to feature satellite connectivity for emergency messaging. The confirmation came from Skylo, a US-based non-terrestrial network (NTN) provider, on Monday. This is the second confirmed information about the South Korean tech giant’s next-generation 3nm processor, whose development was...
-
iPhone 18 Pro, iPhone 18 Pro Max and iPhone 18 Fold Said to Debut With 2nm A20 Chipset in 2026
After using TSMC’s 3nm process for its iPhone 15 Pro and iPhone 16 Pro series, Apple seems to be in a position to switch to an even more efficient 2nm manufacturing process, for its future iPhone 18 Pro models. The 2nm node is expected to bring better power efficiency among other benefits.
-
Samsung Galaxy Z Flip 7 to Arrive With Samsung’s First 3nm Chip After Skipping the Galaxy S25 Series: Report
Samsung’s Galaxy Z lineup this year is going to be an interesting one for several reasons. The book-style foldable, the Samsung Galaxy Z Fold 7 is set to get a bigger display, while the upcoming Galaxy Z Flip clamshell style foldable is said to get minor updates, there’s also a new FE model which showed up in the rumour mill recently. New infor...
-
HP Eyes Software Differentiation as AI PCs Blur the Lines Between Device and Experience
PC brands have found themselves in a unique position ever since the rise of the AI PCs. The terminology refers to a new class of computers that are equipped with dedicated neural processing units (NPUs) to power artificial intelligence (AI) capabilities and workflows. The chipsets are currently being manufactured by AMD, Intel, and Qualcomm’s Sna...
-
Intel CEO Lip-Bu Tan Says Company Will Spin Off Non-Core Units
Intel will spin off assets that aren’t central to its mission and create new products. The company needs to replace the engineering talent it has lost, improve its balance sheet and better attune manufacturing processes to meet the needs of potential customers, Tan said.
-
Apple Said to Ramp Up Hiring Ahead of Plans to Begin iPad, MacBook and AirPods Manufacturing in India
Apple is reportedly expanding its workforce across various divisions in India. Since 2017, the Cupertino-based company has been manufacturing iPhone models in the country and is now aiming to reduce its reliance on China by diversifying its manufacturing processes and enhancing supply chain resilience. As part of this strategy, Apple is said to be ...
