Tsmc

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  iPhone 18 Pro, iPhone 18 Pro Max and iPhone 18 Fold Said to Debut With 2nm A20 Chipset in 2026

  After using TSMC’s 3nm process for its iPhone 15 Pro and iPhone 16 Pro series, Apple seems to be in a position to switch to an even more efficient 2nm manufacturing process, for its future iPhone 18 Pro models. The 2nm node is expected to bring better power efficiency among other benefits.

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  TSMC Says US Tariffs Have Some Impact But AI Demand Robust

  Taiwan's TSMC said on Tuesday that US tariffs were having some impact on the company and had been discussed with Washington. TSMC's Chief Executive C.C. Wei has disclosed that the company had not seen any changes in customer behaviour due to tariff uncertainty.

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  Google Pixel 10 Series to Debut With Satellite Connectivity Despite Switch to MediaTek Modem: Report

  Google is said to make a switch from Samsung Foundry to MediaTek for the modem in its Pixel 10 series, but it will not affect an important connectivity feature. The handsets, which are expected to be unveiled later this year, have been rumoured to feature the Tensor G5 chipset developed in collaboration with TSMC instead of Samsung.

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  Samsung Reportedly Plans to Replace Silicon With Glass Interposers for Advanced AI Chips by 2028

  Samsung Electronics is reportedly developing a new glass substrate for advanced semiconductor packaging. Due to ever-increasing demand for AI chips, the South Korean firm is exploring the use of glass interposers instead of silicon interposers, to cut manufacturing costs and boost performance. Samsung is reportedly focusing on smaller panel prototy...

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  Google and TSMC Strike Long-Term Deal to Manufacture Tensor Chips for Pixel Phones: Report

  Google is expected to unveil its Pixel 10 series later this year with its next-generation SoC — Tensor G5. The new chipset is said to be being developed in partnership with TSMC. As we wait for the arrival of new generation Pixel phones with the new custom-built chip, a report coming out of China suggests that Google will continue its partnershi...

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  Xiaomi XRING O1 Die Shot Reveals Details of 10-Core CPU, 6-Core NPU and More

  Xiaomi XRING O1 was unveiled Thursday on the Xiaomi 15S Pro, marking the company's first in-house chipset. Built on TSMC's advanced 3nm N3E process technology, the XRING O1 features a 10-core CPU, 6-core NPU, and 16-core GPU. A die shot of the XRING O1 reveals the layout of various components on the chipset.

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  Nintendo Turns to Samsung to Make Chips, Ramp Up Switch 2 Output

  Nintendo has turned to Samsung to help make the main chips for the Switch 2. The Korean company is now working on a customized chip or processor designed by Nvidia for the Switch 2 using its 8-nanometer node, according to people familiar with the matter.

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  Xiaomi XRING 01 Chipset Teased by CEO Lei Jun Ahead of Launch

  Xiaomi XRING 01, the tech giant's first in-house smartphone chipset, is slated for launch this month, Xiaomi CEO Lei Jun announced on Weibo. Debuting on a new Xiaomi handset, the high-performance processor aims to lessen Xiaomi's dependence on Qualcomm and MediaTek for smartphone chipsets.

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  Qualcomm Announces Snapdragon 7 Gen 4 SoC With AI Features, Wi-Fi 7 and Bluetooth 6.0

  Qualcomm unveiled the Snapdragon 7 Gen 4 SoC on Thursday. The new mobile platform succeeds the Snapdragon 7 Gen 3 and offers select Snapdragon Elite Gaming features. It is built on TSMC's 4nm process technology and ships with several AI capabilities. It supports Gen AI assistants and popular large language models(LLMs) running directly on device. ...

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  MediaTek Helio G200 Chipset With Up to 40 Percent Improved CPU Performance Launched

  MediaTek on Monday launched the Helio G200 chipset for mobile devices. The Taiwan-based chipmaker says its new processor is aimed at powerful gaming smartphones with a particular emphasis on social and messaging apps enhancement. It is claimed to deliver more than a 40 percent improvement against competitor alternative platforms when it comes to si...

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  MediaTek Dimensity 9500 SoC Tipped to Offer Improved Ray Tracing and AI Performance; Specifications Leak

  Dimensity 9500 SoC is rumoured to be in development as the latest flagship-tier smartphone processor from MediaTek. Ahead of its anticipated debut sometime later this year, a tipster suggests that it could be fabricated using TSMC's N3P process (3nm). Powered by Arm’s latest Cortex-X9 series cores, the chipset is speculated to bring improvements ...

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  Huawei Said to be Readying New AI Chip for Mass Shipment as China Seeks Nvidia Alternatives

  Huawei plans to begin mass shipments of its advanced 910C AI chips to Chinese customers as early as next month. The timing is fortuitous for Chinese AI companies which have been left scrambling for domestic alternatives to the H20, the primary AI chip that Nvidia had until recently been allowed to sell freely in the Chinese market.

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  iPhone 18 Price Hike Likely Due to 'Significant' Cost Increase From Adopting TSMC's 2nm Process, Tipster Claims

  Apple's iPhone 18 lineup could see a price increase when it launches next year, according to a tipster. The potential hike is attributed to the expected adoption of TSMC's next-generation 2nm process node for Apple's 'A20' chipset, which is more costly than the N3P node that is used to produce Apple's A18 and A18 Pro chips.

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  Intel, TSMC Tentatively Agree to Form Chipmaking Joint Venture: Report

  Intel and Taiwan Semiconductor Manufacturing Co have reportedly reached a preliminary agreement to form a joint venture. TSMC, the world's largest contract chipmaker, will take a 20 percent stake in the new company.

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  Snapdragon 8s Gen 4 With Up to 31 Percent Boost in CPU Performance, Adreno 825 GPU Launched

  Snapdragon 8s Gen 4 has been launched as the successor to last year's Snapdragon 8s Gen 3, and the new chip is claimed to deliver enhanced CPU, GPU, and AI performance. Built on TSMC's 4nm process, this chip is expected to arrive on gaming smartphones, with support for hardware-accelerated ray tracing and on-device generative AI. It offers Wi-Fi 7 ...